MICROCHIP SP1F, SP3F Power Module
Litlhaloso
- Product: SP1F and SP3F Power Modules
- Setšoantšo sa AN3500
- Application: PCB Mounting and Power Module Mounting
Selelekela
Sengoloa sena sa kopo se fana ka likhothaletso tsa mantlha tsa ho hokahanya boto ea potoloho e hatisitsoeng (PCB) ho SP1F kapa mojule oa matla oa SP3F le ho kenya mojule oa matla holim'a siling ea mocheso. Latela litaelo tsa ho phahamisa ho fokotsa khatello ea mocheso le ea mochine.
PCB Mounting Litaelo
- The PCB mounted on the power module can be screwed to the standoffs to reduce all mechanical stress and minimize relative movements on the pins that are soldered to the power module. Step 1: Screw the PCB to the standoffs of the power module.
- Sekoti sa plastite se itšebetsang se nang le bophara ba 2.5 mm se khothaletsoa ho hokela PCB. Sekurufu sa plastite, se bontšitsoeng setšoantšong se latelang, ke mofuta oa screw e etselitsoeng ka ho khetheha ho sebelisoa le polasetiki le lisebelisoa tse ling tse tlaase. Bolelele ba screw bo itšetlehile ka botenya ba PCB. Ka PCB e botenya ea 1.6 mm (0.063”), sebelisa sekoahelo sa polasetiki se bolelele ba 6 mm (0.24”). Boholo ba torque e ntseng e phahama ke 0.6 Nm (5 lbf·in). Sheba botšepehi ba poso ea polasetiki ka mor'a ho tiisa li-screws.
- Mohato oa 2: Solder all electrical pins of the power module to the PCB as shown in the following figure. A no-clean solder flux is required to attach the PCB, as the aqueous module cleaning is not allowed.
Hlokomela:
- U se ke ua fetola mehato ena e 'meli, hobane haeba lithakhisa tsohle li rekisoa pele ho PCB, ho phunyeletsa PCB ho li-standoffs ho etsa hore ho be le deformation ea PCB, e leng se lebisang ho khatello e itseng ea mochine e ka senyang lipina kapa ea senya likarolo tsa PCB.
- Likoti ho PCB joalo ka ha ho bonts'itsoe setšoantšong se ka pele ho hlokahala ho kenya kapa ho tlosa li-screws tse ntseng li hola tse koalang mojule oa matla sekoting sa mocheso. Likoti tsena tsa phihlello li tlameha ho ba tse kholo ho lekana hore hlooho ea screw le li-washer li fete ka bolokolohi, ho lumella mamello e tloaelehileng sebakeng sa lesoba la PCB. Bophara ba lesoba la PCB bakeng sa lithakhisa tsa matla bo khothaletsoa ho 1.8 ± 0.1 mm. Sekhahla sa lesoba la PCB bakeng sa ho kenya kapa ho tlosa li-screws tse ntseng li hola li khothaletsoa ho 10 ± 0.1 mm.
- For efficient production, a wave soldering process can be used to solder the terminals to the PCB. Each application, heat sink and PCB can be different; wave soldering must be evaluated on a case-by-case basis. In any case, a well-balanced layer of solder should surround each pin.
- The gap between the bottom of the PCB and the power module is 0.5 mm to 1 mm only as shown in PCB Mounted on Power Module figure. Using through-hole components on the PCB is not recommended.
- SP1F or SP3F pinout can change according to the configuration. See the product datasheet for more information on the pin-out location.
Litaelo tsa ho kenya Module ea Matla
- Ho hlophisoa ka nepo ha sejana sa mojule holim'a sinki ea mocheso ho bohlokoa ho netefatsa phetisetso e ntle ea mocheso. The mocheso teba le matla mojulung kopana holim'a metsi e lokela ho ba bataletseng (ho kgothaletswa flatness e lokela ho ba ka tlaase ho 50 μm bakeng sa 100 limilimithara e tsoelang pele, kgothaletswa kaba Rz 10) le ho hloeka (ha ho na litšila, kutu, kapa tšenyo) ho qoba khatello ea kelello ea mechine ha mojulung oa matla o kenngoa, le ho qoba ho eketseha ha mocheso oa mocheso.
- Mohato oa 1: Tšebeliso ea mafura a mocheso: Ho finyella boemo bo tlaase ka ho fetisisa ho thibela mocheso oa mocheso oa mocheso, ho tlameha ho sebelisoa lesela le tšesaane la mafura a mocheso pakeng tsa mochine oa matla le mocheso oa mocheso. Ho khothalletsoa ho sebelisa mokhoa oa khatiso oa skrine ho etsa bonnete ba hore ho behiloe ka mokhoa o ts'oanang oa botenya ba bonyane ba 60 μm (2.4 mils) holim'a teba ea mocheso joalokaha ho bontšitsoe setšoantšong se latelang. Sebopeho sa mocheso pakeng tsa mochine le mocheso oa mocheso o ka boela oa etsoa ka lisebelisoa tse ling tse tsamaisang mocheso oa mocheso tse kang motsoako oa phetoho ea mekhahlelo (sekirini-se hatisitsoeng kapa se khomarelang).
- Mohato oa 2: Ho kenya mochine oa motlakase holim'a sink ea mocheso: Beha mochine oa matla ka holim'a likoti tsa mocheso 'me u sebelise khatello e nyenyane ho eona. Kenya sekoti sa M4 ka senotlolo le liwashara tse bataletseng lesobeng le leng le le leng le ntseng le hola (sekoti #8 se ka sebelisoa sebakeng sa M4). Bolelele ba "screw" e tlameha ho ba bonyane 12 mm (0.5"). Taba ea pele, tiisa hanyenyane li-screw tse peli tse ntseng li hola. Tiisa li-screw ho fihlela boleng ba torque ea ho qetela bo fihla (sheba setlankane sa sehlahisoa bakeng sa torque e phahameng e lumelletsoeng). Ho khothalletsoa ho sebelisa screwdriver e nang le torque e laoloang bakeng sa ts'ebetso ena. hang ha e tlameletsoe holim'a sinki ea mocheso e nang le torque e loketseng ea mojulung o tlameha ho kolobisoa ka ho felletseng ka mafura a futhumetseng joalo ka ha ho bonts'itsoe ho Grease ho Mojule Ka mor'a Ho qhaqha Lekhalo pakeng tsa li-screw, bophahamo bo ka holimo le setsi se haufi se tlameha ho hlahlojoa ho boloka sebaka se sireletsehileng sa ho pata.
Seboka se Akaretsang View
- Haeba PCB e kholo e sebelisoa, li-spacers tse eketsehileng pakeng tsa PCB le mocheso oa mocheso lia hlokahala. Ho khothalletsoa ho boloka sebaka sa bonyane 5 cm pakeng tsa module ea matla le li-spacers joalokaha ho bontšitsoe setšoantšong se latelang. Li-spacers li tlameha ho ba bolelele bo lekanang le li-standoffs (12 ± 0.1 mm).
- Bakeng sa lits'ebetso tse ikhethileng, li-module tse ling tsa matla tsa SP1F kapa SP3F li entsoe ka AlSiC (Aluminium Silicon Carbide) baseplate (sehlopha sa M ka palo ea karolo). AlSiC baseplate e botenya ka 0.5 mm ho feta baseplate ea koporo, kahoo li-spacers li tlameha ho ba 12.5 ± 0.1 mm ka botenya.
- Bophahamo ba foreimi ea polasetiki ea SP1F le SP3F bo bolelele bo lekanang le ba SOT-227. Ho PCB e le 'ngoe, haeba ho sebelisoa SOT-227 le e le' ngoe kapa tse 'maloa tsa SP1F/SP3F tse nang le baseplate ea koporo,' me haeba sebaka se pakeng tsa li-module tse peli tsa matla se sa fete 5 cm, ha ho hlokahale ho kenya spacer joalokaha ho bontšitsoe setšoantšong se latelang.
- Haeba li-module tsa matla tsa SP1F/SP3F tse nang le AlSiC baseplate li sebelisoa ka SOT-227 kapa li-module tse ling tsa SP1F/SP3F tse nang le baseplate ea koporo, bophahamo ba heatsink bo tlameha ho fokotsoa ka 0.5 mm tlas'a li-module tsa SP1F/SP3F tse nang le AlSiC baseplate ho boloka li-standoffs tsohle tsa module ka bophahamo bo lekanang.
- Tlhokomelo e tlameha ho nkuoa ka likarolo tse boima joalo ka li-electrolytic kapa polypropylene capacitor, li-transformer, kapa li-inductors. Haeba likarolo tsena li le sebakeng se le seng, ho kgothaletswa ho eketsa li-spacers esita le haeba sebaka se pakeng tsa li-module tse peli se sa fete 5 cm e le hore, boima ba likarolo tsena boto ha bo sebetsane le mojule oa matla empa ke li-spacers. Leha ho le joalo, kopo ka 'ngoe, teba ea mocheso, le PCB li fapane; sebaka sa li-spacers se tlameha ho hlahlojoa ho latela maemo.
Power Module Dismounting Instructions
To safely remove the power module from the heatsink, perform following steps:
- On the PCB, remove all screws from the spacers.
- On the heatsink, remove all screws from the power module mounting holes.
Tlhokomeliso
Depending on the thermal interface material, the module baseplates may adhere strongly to the heatsink. Do not pull on the PCB to remove the assembly, as this may damage the PCB or the modules. To prevent damage, detach each module from the heatsink before removal. - To safely detach the modules:
- Insert a thin blade, such as the tip of a flat screwdriver, between the module baseplate and the heatsink.
- Gently twist the blade to separate the baseplate from the heatsink.
- Repeat this process for each module mounted to the PCB.
Qetello
This application note gives the main recommendations regarding the mounting of SP1F or SP3F modules. Applying these instructions helps decrease the mechanical stress on PCB and power module, while ensuring long term operation of the system. Mounting instructions to the heatsink must also be followed to achieve the lowest thermal resistance from the power chips down to the cooler. All these steps are essential to guarantee the best system reliability.
Nalane ea Phetoho
Nalane ea ntlafatso e hlalosa liphetoho tse kentsoeng tšebetsong tokomaneng. Liphetoho li thathamisitsoe ka ntlafatso, ho qala ka khatiso ea morao-rao.
| Khatiso | Letsatsi | Tlhaloso |
| B | 10/2025 | E kentsoe Power Module Dismounting Instructions. |
| A | 05/2020 | Ena ke tokollo ea pele ea tokomane ena. |
Boitsebiso ba Microchip
Matšoao a khoebo
- Lebitso la "Microchip" le logo, "M" logo, le mabitso a mang, li-logo, le li-brand ke matshwao a khoebo a ngolisitsoeng le a sa ngolisoang a Microchip Technology Incorporated kapa mekhatlo e amanang le eona le/kapa lithuso tsa United States le/kapa linaheng tse ling ("Microchip). Matshwao a kgwebo”). Tlhahisoleseding e mabapi le Microchip Trademarks e ka fumanoa ho https://www.microchip.com/en-us/about/legal-information/microchip-trademarks.
- ISBN: 979-8-3371-2109-3
Tsebiso ea Molao
- Khatiso ena le lintlha tse mona li ka sebelisoa feela le lihlahisoa tsa Microchip, ho kenyeletsoa ho rala, ho leka, le ho kopanya lihlahisoa tsa Microchip le kopo ea hau. Tšebeliso ea tlhahisoleseling ena ka tsela efe kapa efe e tlola melaoana ena. Lintlha mabapi le lits'ebetso tsa sesebelisoa li fanoe molemong oa hau feela 'me li ka nkeloa sebaka ke liapdeite. Ke boikarabello ba hau ho netefatsa hore kopo ea hau e kopana le litlhaloso tsa hau. Ikopanye le ofisi ea thekiso ea Microchip ea lehae bakeng sa tšehetso e eketsehileng kapa, fumana tšehetso e eketsehileng ho www.microchip.com/en-us/support/design-help/client-support-services.
- TSEBISO ENA E FUMANA KE MICROCHIP "JOALOKAHA E LE". MICROCHIP HA E ETSE LITLHAKISO KAPA LITIISETSO TSA MOFUTA OFE kapa O fe Ebang E BONAHALA KAPA E BONAHALA, E NGOLOA KAPA MOLOMO, MOLAO KAPA HO SE EMONG, E Amanang le LITSEBISO HO kenyeletsoa EMPA E SA FUMANE LE TIISETSO EFE KAPA EFE E FUMANEHLENG LE TLAMELO. BAKENG SA MORERO O KHETHEHILENG, KAPA LITIISETSO TSE AMANG LE MAEMO A OONA, BOLEMO, KAPA KETSAHALO EA OONA.
HA HO LE TSATSAHALO, MICROCHIP E TLA BA MOTHO OA MOLATO BAKENG SA LITABA LIFE, TSE KHETHEHILENG, TSA KOTSI, TSATSAHALO, KAPA TAHLEHELO E LATELANG, TŠENYEHO, LITŠEnyehelo, KAPA LITJEHO TSA MOFUTA OFE O TLANG LE LITSEBISO KAPA TŠEBELETSO EA LONA, LE HO KA ETSAHALA KETSAHALO E ETSANG. TSE KA E KA ETSAHANG KAPA MESEKO E BONAHALA. HO FIHLELA KA HO FETISISA HO DUMELLA KE MOLAO, BOIKARABELO KAOFELA BA MICROCHIP HO LIKELETSO KAOFELA KA TSELA EFE KAPA E MABAPI LE TSEBISO KAPA TŠEBELETSO EA YONA E KE KE E FEELA BOLIMO OA LITEFO, HA E LE TSE LE FELA, TSEO U LI LEFILENG KA THOTLHALA BAKENG SA MICROCHIP. - Tšebeliso ea lisebelisoa tsa Microchip ts'ehetso ea bophelo le/kapa lits'ebetso tsa ts'ireletso e kotsing ea moreki, 'me moreki o lumela ho sireletsa, ho qosa le ho boloka Microchip e se nang kotsi ho tsoa lits'enyehelo tsohle, likopo, lisutu, kapa litšenyehelo tse bakoang ke ts'ebeliso e joalo. Ha ho lilaesense tse fetisoang, ka mokhoa o hlakileng kapa ka tsela e 'ngoe, tlasa litokelo life kapa life tsa thepa ea mahlale a Microchip ntle le ha ho boletsoe ka tsela e ngoe.
Karolo ea Tšireletso ea Khoutu ea Lisebelisoa tsa Microchip
Ela hloko lintlha tse latelang tsa ts'ireletso ea khoutu lihlahisoa tsa Microchip:
- Lihlahisoa tsa Microchip li kopana le litlhaloso tse fumanehang ho Microchip Data Sheet ea bona.
- Microchip e lumela hore lihlahisoa tsa eona li sireletsehile ha li sebelisoa ka mokhoa o reriloeng, ka har'a litlhaloso tsa ts'ebetso, le tlas'a maemo a tloaelehileng.
- E boloka boleng ba Microchip mme ka mabifi e sireletsa litokelo tsa eona tsa thepa ea mahlale. Boiteko ba ho tlola likarolo tsa ts'ireletso ea khoutu ea lihlahisoa tsa Microchip bo thibetsoe ka thata mme bo ka tlola Digital Millennium Copyright Act.
- Ha ho Microchip kapa moetsi ofe kapa ofe oa semiconductor ea ka netefatsang ts'ireletso ea khoutu ea eona. Tšireletso ea khoutu ha e bolele hore re tiisa hore sehlahisoa "se ke ke sa robeha". Tšireletso ea khoutu e lula e fetoha. Microchip e ikemiselitse ho tsoela pele ho ntlafatsa likarolo tsa ts'ireletso ea khoutu ea lihlahisoa tsa rona.
LBH
Can I use a wave soldering process for soldering terminals to the PCB?
Yes, a wave soldering process can be used for efficient production. However, evaluate its suitability based on your specific application, heat sink, and PCB requirements.
Is it necessary to install a spacer between power modules?
If the distance between two power modules does not exceed 5 cm and they are mounted on the same PCB with a SOT-227, it is not necessary to install a spacer.
Litokomane / Lisebelisoa
 |
MICROCHIP SP1F, SP3F Power Module [pdf] Buka ea Taelo SP1F, SP3F, AN3500, SP1F SP3F Power Module, SP1F SP3F, Power Module, Module |